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INTRODUCTION

This datasheet contains the specifications for the Advanced Boot Block flash memory family, which is optimized for low power, portable systems. This family of products features 1.65 V¨C2.5 V or 2.7 V¨C 3.6 V I/Os and a low VCC/VPP operating range of 2.7 V¨C3.6 V for read, program, and erase operations.

¡ö Flexible SmartVoltage Technology

- 2.7 V¨C3.6 V Read/Program/Erase

- 12 V VPP Fast Production

Programming

¡ö 2.7 V or 1.65 V I/O Option

- Reduces Overall System Power

¡ö High Performance

- 2.7 V¨C3.6 V: 90 ns Max Access Time

- 3.0 V¨C3.6 V: 80 ns Max Access Time

¡ö Optimized Block Sizes

- Eight 8-KB Blocks for Data,

Top or Bottom Locations

- Up to Sixty-Three 64-KB Blocks for

Code

¡ö Block Locking

- VCC-Level Control through WP#

¡ö Low Power Consumption

- 10 mA Typical Read Current

¡ö Absolute Hardware-Protection

- VPP = GND Option

- VCC Lockout Voltage

¡ö Extended Temperature Operation

- ¨C40 ¡ãC to +85 ¡ãC

¡ö Flash Data Integrator Software

- Flash Memory Manager

- System Interrupt Manager

- Supports Parameter Storage,

Streaming Data (e.g., Voice)

¡ö Automated Program and Block Erase

- Status Registers

¡ö Extended Cycling Capability

- Minimum 100,000 Block Erase

Cycles Guaranteed

¡ö Automatic Power Savings Feature

- Typical ICCS after Bus Inactivity

¡ö Standard Surface Mount Packaging

- 48-Ball ?BGA* Package

- 48-Lead TSOP Package

- 40-Lead TSOP Package

¡ö Footprint Upgradeable

- Upgrade Path for 4-, 8-, 16-, and 32-

Mbit Densities

¡ö ETOX? VI (0.25 ?) Flash Technology