利博·(集团)有限公司官网

Description

The IRF6623 combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80.

? Application Specific MOSFETs

? Ideal for CPU Core DC-DC Converters

? Low Conduction Losses

? Low Switching Losses

? Low Profile (<0.7 mm)

? Dual Sided Cooling Compatible

? Compatible with Existing Surface Mount Techniques