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MPFS250TS-1FCG484I中文资料
MPFS250TS-1FCG484I数据手册规格书PDF详情
PolarFire? SoC is built upon the award-winning PolarFire FPGA non-volatile FPGA platform. Featuring a five core Linux capable processor subsystem based on the RISC-V ISA, PolarFire SoC brings to market an innovative, midrange, embedded compute platform that inherits all the benefits of the PolarFire FPGA product family. The RISC-V CPU micro-architecture implementation is a simple, 5-stage single issue in order pipeline that does not suffer from the Meltdown and Spectre exploits found in common out-of-order machines. All five CPU cores are coherent with the memory subsystem allowing a versatile mix of deterministic real time systems and Linux in a single, multi-core CPU cluster. With Secure Boot built-in, innovative Linux and Real Time modes, a large Flexible L2 memory subsystem, and a rich set of embedded peripherals, PolarFire SoC provides designers new choices in secure, power-efficient, embedded compute platforms. This document describes the features of PolarFire SoC extended commercial (0 °C to 100 °C Tj) and industrial (–40 °C to 100 °C Tj) device offerings.
MPFS250TS-1FCG484I供应商...
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
深圳市微纳尔电子实业有限公司 |
MPFS250TS-1FCSG536I |
Microchip |
21+ |
Low Profile Fine Pitch Ball Gr |
15000 |
只做原装 |
|
深圳市水星电子有限公司 |
MPFS250TS-1FCSG536I |
Microchip |
24+ |
536-LFBGA |
3973 |
专注Microchip品牌原装正品代理分销,认准水星电子 |
|
深圳市实中创科技有限公司 |
MPFS250TS-1FCVG484I |
Microchip |
23+ |
TO-18 |
12800 |
原装正品代理商最优惠价格,现货或订货 |
|
深圳市宏捷佳电子科技有限公司 |
MPFS250TS-1FCSG536I |
Microchip Technology |
24+ |
536-LFBGA CSPBGA |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|
深圳市芯宇华航科技有限公司 |
MPFS250TS-1FCSG536I |
Microchip Technology / Atmel |
22+ |
BGA-536 |
9655 |
Microchip原厂窗口,华南区一级分销商/军用单位指定合供方/只做原装,自家现货 |
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MPFS250TS-1FCG484I 产品相关型号
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- UC-45L
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Microchip Technology 微芯科技股份有限公司
微芯科技股份有限公司(英语:MicrochipTechnologyInc.,英文简写:Microchip),是一个美国微控制器、内存与类比半导体制造商。它的产品包含微控制器(PIC微控制器、dsPIC/PIC24、PIC32)、序列式EEPROM、序列式SRAM、KEELOQ组件、无线电频率(RF)组件、热组件、功率与电池管理类比组件,也有线性、接口与混合信号组件。还有一些接口组件包含USB、ZigBee/MiWi,CANbus与Ethernet。公司总部位于亚利桑那州钱德勒,晶圆厂则分别位于亚利桑那州坦佩及奥勒冈州格雷斯罕。主要的竞争者有亚德诺半导体、爱特梅尔、飞思卡尔(分拆自摩托罗拉)、英