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Distinctive Characteristics

Subminiature size saves space on PC boards.

Specifically developed for logic-level applications.

Totally sealed body construction prevents contact contamination and allows time- and money-saving automated soldering and cleaning.

Award-winning STC contact mechanism with benefits unavailable in conventional mechanisms: smoother, positive detent actuation, increased contact stability and unparalleled logic-level reliability. (Additional STC details in Terms & Acronyms; see Supplement contents.)

Molded-in, epoxy sealed or ultrasonically welded terminals lock out flux, solvents, and other contaminants.

.100¡± x .100¡± (2.54mm x 2.54mm) terminal spacing conforms to standard PC board grid spacing.

Toggle option in antistatic material available for dissipating electrostatic discharges.

Matching indicators available and shown at the end of Section M.