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    MIMX8MN1CVPJZAA中文资料

    厂家型号

    MIMX8MN1CVPJZAA

    文件大小

    1171.25Kbytes

    页面数量

    114

    功能描述

    i.MX 8M Nano Applications Processor Datasheet for Industrial Products

    数据手册

    下载地址一下载地址二到原厂下载

    生产厂商

    NXP Semiconductors

    简称

    nxp恩智浦

    中文名称

    恩智浦半导体公司官网

    LOGO

    MIMX8MN1CVPJZAA数据手册规格书PDF详情

    Feature

    Cortex?-A53 MPCore platform

    Quad symmetric Cortex? -A53 processors

    ? 32 KB L1 Instruction Cache

    ? 32 KB L1 Data Cache

    ? Media Processing Engine (MPE) with Arm? NEONTM technology supporting the

    Advanced Single Instruction Multiple Data architecture:

    ? Floating Point Unit (FPU) with support of the Arm? VFPv4-D16 architecture

    Cortex?-M7 core platform

    Low power microcontroller available for customer application:

    ? low power standby mode

    ? IoT features including Weave

    ? Manage IR or wireless remote

    ? ML inference applications (enhanced for i.MX 8M Nano)

    Cortex? M7 CPU:

    ? 256 KB tightly coupled memory (TCM)

    Connectivity

    One USB 2.0 OTG controllers with integrated PHY interfaces:

    ? Spread spectrum clock support

    Three Ultra Secure Digital Host Controller (uSDHC) interfaces:

    ? MMC 5.1 compliance with HS400 DDR signaling to support up to 400 MB/sec

    ? SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100

    MB/sec

    ? Support for SDXC (extended capacity)

    One Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE),

    Ethernet AVB, and IEEE 1588

    Four Universal Asynchronous Receiver/Transmitter (UART) modules

    Four I2C modules

    Three SPI modules

    On-chip memory

    Boot ROM (256 KB)

    On-chip RAM (512 KB + 32 KB)

    GPIO and pin multiplexing

    General-purpose input/output (GPIO) modules with interrupt capability

    Input/output multiplexing controller (IOMUXC) to provide centralized pad control

    Power management

    Temperature sensor with programmable trip points

    Flexible power domain partitioning with internal power switches to support efficient

    power management

    External memory interface

    16-bit DRAM interfaces:

    ? LPDDR4-3200

    ? DDR4-2400

    ? DDR3L-1600

    8-bit NAND-Flash, including support for Raw MLC/SLC devices, BCH ECC up to

    62-bit, and ONFi3.2 compliance (clock rates up to 100 MHz and data rates up to 200

    MB/sec)

    eMMC 5.1 Flash (3 interfaces)

    SPI NOR Flash (3 interfaces)

    QuadSPI Flash with support for XIP (for Cortex?-M7 in low-power mode) and parallel

    read mode of two identical FLASH devices

    Multimedia

    Graphic Processing Unit:

    ? GC7000UL with OpenCL and Vulkan support

    ? 2 shader

    ? 99.8 million triangles/sec

    ? 0.6 giga pixel/sec

    ? 9.6 GFLOPs 32-bit/19.2 GFLOPs 16-bit

    ? Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL

    ? Core clock frequency of 600 MHz

    ? Shader clock frequency of 600 MHz

    LCDIF Display Controller:

    ? Support up to 1080p60 display through MIPI DSI

    MIPI Interfaces:

    ? 4-lane MIPI DSI interface

    ? 4-lane MIPI CSI interface

    Audio:

    ? S/PDIF input and output, including a raw capture input mode

    ? Five external synchronous audio interface (SAI) modules supporting I2S, AC97,

    TDM, codec/DSP, and DSD interfaces, comprising one SAI with 4 Tx and 4 Rx

    lanes, two SAI with 2 Tx and 2 Rx lanes, and two SAI with 1 Tx and 1Rx lane. All

    ports support 49.152 MHz BCLK.

    ? ASRC supports processing 32 audio channels, 4 context groups, 8 kHz to 384 kHz

    sample rate and 1/16 to 8x sample rate conversion ratio.

    ? Pulse Density Modulation (PDM) input

    Security

    Resource Domain Controller (RDC):

    ? supports 4 domains and up to 8 regions of DDR

    Arm? TrustZone? (TZ) architecture:

    ? Arm? Cortex-A53 MPCore TrustZone support

    On-chip RAM (OCRAM) secure region protection using OCRAM controller

    High Assurance Boot (HAB)

    Cryptographic acceleration and assurance module (CAAM):

    ? Support Widevine and PlayReady content protection

    ? Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms

    ? Real-time integrity checker (RTIC)

    ? DRM support for RSA, AES, 3DES, DES

    ? Side channel attack resistance

    ? True random number generation (RNG)

    ? Manufacturing protection support

    Secure non-volatile storage (SNVS):

    ? Secure real-time clock (RTC)

    Secure JTAG controller (SJC)

    System debug

    Arm? CoreSightTM debug and trace technology

    Trace Port Interface Unit (TPIU) to support off-chip real-time trace

    Embedded Trace FIFO (ETF) with 4 KB internal storage to provide trace buffering

    Unified trace capability for Quad Cortex?-A53 and Cortex?-M7 CPUs

    Cross Triggering Interface (CTI)

    Support for 4-pin (JTAG) debug interface

    MIMX8MN1CVPJZAA供应商...

    更新时间:2025-3-14 14:08:00
    供应商 型号 品牌 批号 封装 库存 备注 价格
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    NXP/恩智浦
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    NXP(恩智浦)
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    NXP Semiconductors 恩智浦半导体公司

    中文资料: 74311条

    NXP恩智浦半导体(NXP Semiconductors)简称NXP,成立于2006年,其前身是1953年成立的荷兰飞利浦公司。公司总部位于荷兰埃因霍温,拥有超过五十年的悠久历史,目前在全球30多个国家和地区拥有约30,000名员工。2015年,NXP与另一家领先的半导体公司飞思卡尔(Freescale)合并,通过这一战略举措,公司在物联网和汽车领域进一步拓展了业务,重点发展安全可靠的边缘计算、连接技术和高效的电源管理解决方案。 在智能驾驶辅助系统(ADAS)、下一代电动汽车以及跨物联网、移动设备和汽车生态系统的安全连接等关键领域,NXP确立了市场领导地位。根据2021年的数据显示,NXP在微

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