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Surface Mount Fuse, 10.1 x 3.22 mm, Time-Lag T, Telecom

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Technical Data

Rated Voltage 600 VAC, 125 VDC

Rated current 0.5 - 2 A

Breaking Capacity 60 A

Characteristic Time-Lag T

Mounting PCB,SMT

Admissible Ambient Air Temp. -55 ¡ãC to 125 ¡ãC

Climatic Category 55/125/21 acc. to IEC 60068-1

Material: Housing Ceramic

Material: Terminals Tin-Plated Copper Alloy

Unit Weight 0.23 g

Storage Conditions 0 ¡ãC to 60 ¡ãC, max. 70 r.h.

Product Marking , Type, Current, Characteristic

Soldering Methods Reflow

Solderability 245 ¡ãC / 3 sec acc. to IEC 60068-2-58,

Test Td

Resistance to Soldering Heat 260 ¡ãC / 10 sec acc. to IEC 60068-2-58,

Test Td

Flammability min. UL 94V-1

(acc. to EIA/IS-722, Test 4.12)

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    Surface Mount Fuse, 10.1 x 3.22 mm, Time-Lag T, Telecom

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TF600 ²úÆ·Ïà¹ØÐͺÅ

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  • APW7276QBI-TRG
  • MBRF30150CT
  • RNS0J102MDN1
  • RNS0J151MDN1
  • RNS0J221MDN1
  • RNS0J331MDN1
  • RNS0J391MDN1
  • RNS0J470MDS1
  • RNS0J681MDN1
  • RNS0J821MDN1
  • TEP5B3CM
  • TEP5B5CL
  • TEP5B5CM
  • TEP5V6CL
  • TEP5Z
  • TEP5Z12
  • TEP5Z15
  • TEP5Z2.5M
  • TEP5Z24
  • TEP5Z2V5
  • TEP5Z3.3C
  • TEP5Z36
  • TEP5Z3V3
  • TF600_V01
  • XPC755CRX450LE

SCHURTERÏà¹Øµç·ͼ

  • SCILICON
  • SCIOSENSE
  • SDC
  • SDIC
  • SEAGATE
  • SEAWARD
  • SECELECTRONICS
  • SECOS
  • SEI
  • SELEC
  • SEME-LAB
  • SEMICO

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