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DESCRIPTION

The Max247? package is a new high volume power package exibiting the same footprint as the industry standard TO-247, but designed to accomodate much larger silicon chips, normally supplied in bigger packages such as TO-264. The increased die capacity makes the device ideal to reduce component count in multiple paralleled designs and save board space with respect to larger packages.

■ TYPICAL RDS(on) = 0.5 ?

■ EFFICIENT AND RELIABLE MOUNTING THROUGH CLIP

■ ± 30V GATE TO SOURCE VOLTAGE RATING

■ REPETITIVE AVALANCHE TESTED

■ LOW INTRINSIC CAPACITANCE

■ 100 AVALANCHE TESTED

■ GATE CHARGE MINIMIZED

■ REDUCED THRESHOLD VOLTAGE SPREAD

APPLICATIONS

■ HIGH CURRENT, HIGH SPEED SWITCHING

■ SWITCH MODE POWER SUPPLIES (SMPS)

■ DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES (UPS)