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AM6252ASGGHAALW数据手册规格书PDF详情
1 Features
Processor Cores:
? Up to Quad 64-bit Arm? Cortex?-A53
microprocessor subsystem at up to 1.4 GHz
– Quad-core Cortex-A53 cluster with 512KB L2
shared cache with SECDED ECC
– Each A53 Core has 32KB L1 DCache with
SECDED ECC and 32KB L1 ICache with Parity
protection
? Single-core Arm? Cortex?-M4F MCU at up to 400
MHz
– 256KB SRAM with SECDED ECC
? Dedicated Device/Power Manager
Multimedia:
? Display subsystem
– Dual display support
– 1920x1080 @ 60fps for each display
– 1x 2048x1080 + 1x 1280x720
– Up to 165 MHz pixel clock support with
Independent PLL for each display
– OLDI (4 lanes LVDS - 2x) and DPI (24-bit RGB
LVCMOS)
– Support safety feature such as freeze frame
detection and MISR data check
? 3D Graphics Processing Unit
– 1 pixel per clock or higher
– Fillrate greater than 500 Mpixels/sec
– >500 MTexels/s, >8 GFLOPs
– Supports at least 2 composition layers
– Supports up to 2048x1080 @60fps
– Supports ARGB32, RGB565 and YUV formats
– 2D graphics capable
– OpenGL ES 3.1, Vulkan 1.2
? One Camera Serial interface (CSI-Rx) - 4 Lane
with DPHY
– MIPI? CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
– Support for 1,2,3 or 4 data lane mode up to
1.5Gbps
– ECC verification/correction with CRC check +
ECC on RAM
– Virtual Channel support (up to 16)
– Ability to write stream data directly to DDR via
DMA
Memory Subsystem:
? Up to 816KB of On-chip RAM
– 64KB of On-chip RAM (OCSRAM) with
SECDED ECC , Can be divided into smaller
banks in increments of 32KB for as many as 2
separate memory banks
– 256KB of On-chip RAM with SECDED ECC in
SMS Subsystem
– 176KB of On-chip RAM with SECDED ECC in
SMS Subsystem for TI security firmware
– 256KB of On-chip RAM with SECDED ECC in
Cortex-M4F MCU subsystem
– 64KB of On-chip RAM with SECDED ECC in
Device/Power Manager Subsystem
? DDR Subsystem (DDRSS)
– Supports LPDDR4, DDR4 memory types
– 16-Bit data bus with inline ECC
– Supports speeds up to 1600 MT/s
– Max addressable range
? 8GBytes with DDR4
? 4GBytes with LPDDR4
Functional Safety:
? Functional Safety-Compliant targeted [Industrial]
– Developed for functional safety applications
– Documentation will be available to aid IEC
61508 functional safety system design
– Systematic capability up to SIL 3 targeted
– Hardware Integrity up to SIL 2 targeted
– Safety-related certification
? IEC 61508 by TUV SUD planned
? Functional Safety-Compliant targeted [Automotive]
– Developed for functional safety applications
– Documentation will be available to aid ISO
26262 functional safety system design
– Systematic capability up to ASIL D targeted
– Hardware integrity up to ASIL B targeted
– Safety-related certification
? ISO 26262 by TUV SUD planned
? AEC - Q100 qualified
Security:
? Secure boot supported
– Hardware-enforced Root-of-Trust (RoT)
– Support to switch RoT via backup key
– Support for takeover protection, IP protection,
and anti-roll back protection
? Trusted Execution Environment (TEE) supported
– Arm TrustZone? based TEE
– Extensive firewall support for isolation
– Secure watchdog/timer/IPC
– Secure storage support
– Replay Protected Memory Block (RPMB)
support
? Dedicated Security Controller with user
programmable HSM core and dedicated security
DMA & IPC subsystem for isolated processing
? Cryptographic acceleration supported
– Session-aware cryptographic engine with ability
to auto-switch key-material based on incoming
data stream
? Supports cryptographic cores
– AES – 128-/192-/256-Bit key sizes
– SHA2 – 224-/256-/384-/512-Bit key sizes
– DRBG with true random number generator
– PKA (Public Key Accelerator) to Assist in
RSA/ECC processing for secure boot
? Debugging security
– Secure software controlled debug access
– Security aware debugging
PRU Subsystem:
? Dual-core Programmable Real-Time Unit
Subystem (PRUSS) running up to 333 MHz
? Intended for driving GPIO for cycle accurate
protocols such as additional:
– General Purpose Input/Output (GPIO)
– UARTs
– I2C
– External ADC
? 16KByte program memory per PRU with SECDED
ECC
? 8KB data memory per PRU with SECDED ECC
? 32KB general purpose memory with SECDED
ECC
? CRC32/16 HW accelerator
? Scratch PAD memory with 3 banks of 30 x 32-bit
registers
? 1 Industrial 64-bit timer with 9 capture and
16 compare events, along with slow and fast
compensation
? 1 interrupt controller (INTC), minimum of 64 input
events supported
High-Speed Interfaces:
? Integrated Ethernet switch supporting (total 2
external ports)
– RMII(10/100) or RGMII (10/100/1000)
– IEEE1588 (Annex D, Annex E, Annex F with
802.1AS PTP)
– Clause 45 MDIO PHY management
– Packet Classifier based on ALE engine with
512 classifiers
– Priority based flow control
– Time sensitive networking (TSN) support
– Four CPU H/W interrupt Pacing
– IP/UDP/TCP checksum offload in hardware
? Two USB2.0 Ports
– Port configurable as USB host, USB peripheral,
or USB Dual-Role Device (DRD mode)
– Integrated USB VBUS detection
– Trace over USB supported
General Connectivity:
? 9x Universal Asynchronous Receiver-Transmitters
(UART)
? 5x Serial Peripheral Interface (SPI) controllers
? 6x Inter-Integrated Circuit (I2C) ports
? 3x Multichannel Audio Serial Ports (McASP)
– Transmit and Receive Clocks up to 50 MHz
– Up to 16/10/6 Serial Data Pins across 3x
McASP with Independent TX and RX Clocks
– Supports Time Division Multiplexing (TDM),
Inter-IC Sound (I2S), and Similar Formats
– Supports Digital Audio Interface Transmission
(SPDIF, IEC60958-1, and AES-3 Formats)
– FIFO Buffers for Transmit and Receive (256
Bytes)
– Support for audio reference output clock
? 3x enhanced PWM modules (ePWM)
? 3x enhanced Quadrature Encoder Pulse modules
(eQEP)
? 3x enhanced Capture modules (eCAP)
? General-Purpose I/O (GPIO), All LVCMOS I/O can
be configured as GPIO
? 3x Controller Area Network (CAN) modules with
CAN-FD support
– Conforms w/ CAN Protocol 2.0 A, B and ISO
11898-1
– Full CAN FD support (up to 64 data bytes)
– Parity/ECC check for Message RAM
– Speed up to 8Mbps
Media and Data Storage:
? 3x Multi-Media Card/Secure Digital? (MMC/SD?)
interface
– 1x 8-bit eMMC interface up to HS200 speed
– 2x 4-bit SD/SDIO interface up to UHS-I
– Compliant with eMMC 5.1, SD 3.0 and SDIO
Version 3.0
? 1× General-Purpose Memory Controller (GPMC)
up to 133 MHz
– Flexible 8- and 16-Bit Asynchronous Memory
Interface With up to four Chip (22-bit address)
Selects (NAND, NOR, Muxed-NOR, and
SRAM)
– Uses BCH Code to Support 4-, 8-, or 16-Bit
ECC
– Uses Hamming Code to Support 1-Bit ECC
– Error Locator Module (ELM)
? Used With the GPMC to Locate Addresses
of Data Errors From Syndrome Polynomials
Generated Using a BCH Algorithm
? Supports 4-, 8-, and 16-Bit Per 512-Byte
Block Error Location Based on BCH
Algorithms
? OSPI/QSPI with DDR / SDR support
– Support for Serial NAND and Serial NOR flash
devices
– 4GBytes memory address support
– XIP mode with optional on-the-fly encryption
Power Management:
? Low power modes supported by Device/Power
Manager
– Partial IO support for CAN/GPIO/UART wakeup
– DeepSleep
– MCU Only
– Standby
– Dynamic frequency scaling for Cortex-A53
Optimal Power Management Solution:
? Recommended TPS65219 Power Management
ICs (PMIC)
– Companion PMIC specially designed to meet
device power supply requirements
– Flexible mapping and factory programmed
configurations to support different use cases
Boot Options:
? UART
? I2C EEPROM
? OSPI/QSPI Flash
? GPMC NOR/NAND Flash
? Serial NAND Flash
? SD Card
? eMMC
? USB (host) boot from Mass Storage device
? USB (device) boot from external host (DFU mode)
? Ethernet
Technology / Package:
? 16-nm technology
? 13 mm x 13 mm, 0.5-mm pitch, 425-pin FCCSP
BGA (ALW)
? 17.2 mm x 17.2 mm, 0.8-mm pitch, 441-pin
FCBGA (AMC)
2 Applications
? Human Machine Interfaces (HMI)
? Retail automation
? Driver Monitoring System (DMS/OMS) / In-Cabin Monitoring (ICM)
? Telematics Control Unit (TCU)
? 3D Point Cloud
? Vehicle to Infrastructure / Vehicle to Vehicle (V2X / V2V)
? 3D Re-configurable automotive instrument cluster
? Appliance user interface and connectivity
? Medical equipment
3 Description
The low-cost AM62x Sitara? MPU family of application processors are built for Linux? application development.
With scalable Arm? Cortex?-A53 performance and embedded features, such as: dual-display support and 3D
graphics acceleration, along with an extensive set of peripherals that make the AM62x device well-suited for
a broad range of industrial and automotive applications while offering intelligent features and optimized power
architecture as well.
Some of these applications include:
? Industrial HMI
? EV charging stations
? Touchless building access
? Driver monitoring systems
AM62x Sitara? processors are industrial-grade in the 13 x 13 mm package (ALW) and can meet the AEC -
Q100 automotive standard in the 17.2 x 17.2 mm package (AMC). Industrial and Automotive functional safety
requirements can be addressed using the integrated Cortex-M4F cores and dedicated peripherals, which can all
be isolated from the rest of the AM62x processor.
The 3-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking
(TSN) support. An additional PRU module on the device enables real-time I/O capability for customer’s own
use cases. In addition, the extensive set of peripherals included in AM62x enables system-level connectivity,
such as: USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external
ASIC/FPGA. The AM62x device also supports secure boot for IP protection with the built-in Hardware Security
Module (HSM) and employs advanced power management support for portable and power-sensitive applications
Products in the AM62x processor family:
? AM625 – Human-machine Interaction SoC with Arm? Cortex?-A53 based edge AI and full-HD dual-display
? AM625-Q1 – Automotive Display SoC with embedded safety for digital clusters
? AM623 – Internet of Thinks (IoT) and Gateway SoC with Arm? Cortex?-A53 based object and gesture
recognition
? AM620-Q1 – Automotive Compute SoC with embedded safety for driver monitoring, networking and V2X
systems
AM6252ASGGHAALW供应商...
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
芯权科技(深圳)有限公司 |
AM6252ATCGGAALW |
TI/德州仪器 |
23+ |
FCCSP-425 |
8355 |
只做原装现货/实单可谈/支持含税拆样 |
|
深圳市水星电子有限公司 |
AM6252ATCGGAALW |
TI |
24+ |
425-VFBGA |
39445 |
专注TI品牌原装正品代理分销,认准水星电子 |
|
现代芯城(深圳)科技有限公司 |
AM6254ATCGGAALW |
24+ |
N/A |
62000 |
一级代理-主营优势-实惠价格-不悔选择 |
||
深圳市芯球通科技有限公司 |
AM6254ATCGGAALW |
TI(德州仪器) |
23+ |
13650 |
公司只做原装正品,假一赔十 |
||
深圳市德力诚信科技有限公司 |
AM6254ATCGGAALW |
TI |
24+ |
con |
313887 |
优势库存,原装正品 |
|
深圳市创新迹电子有限公司 |
AM625JIXJ44JB |
AMD |
23+ |
BGA |
7300 |
专注配单,只做原装进口现货 |
|
深圳市安富世纪电子有限公司 |
AM625JIXJ44JB |
AMD |
23+ |
BGA |
7300 |
专注配单,只做原装进口现货 |
|
深圳市佳鑫美电子科技有限公司 |
AM6264LFP |
HIT |
24+ |
SOP28W |
3629 |
原装优势!房间现货!欢迎来电! |
|
深圳市芯诚实创科技有限公司 |
AM628128DLFP-5 |
HITACHI |
2022 |
SOP32 |
3080 |
原装正品 |
|
深圳市益百分电子有限公司 |
AM6289 |
AMTEK |
06+ |
HSOP |
73 |
全新原装进口自己库存优势 |
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AM6252ASGGHAALW 产品相关型号
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Texas Instruments
德州仪器(Texas Instruments),简称TI,是全球领先的半导体公司,为现实世界的信号处理提供创新的数字信号处理(DSP)及模拟器件技术。除半导体业务外,还提供包括传感与控制、教育产品和数字光源处理解决方案。TI总部位于美国德克萨斯州的达拉斯,并在25多个国家设有制造、设计或销售机构。德州仪器是推动互联网时代不断发展的半导体引擎,作为实时技术的领导者,TI正在快速发展,在无线与宽带接入等大型市场及数码相机和数字音频等新兴市场方面,凭借性能卓越的半导体解决方案不断推动着互联网时代的前进步伐。TI预想未来世界的方方面面都渗透着TI产品的点点滴滴,每个电话、每次上网、拍的每张照片、听的每