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FEATURES

? Lowest molded height (3.0 mm) in this package

footprint

? Shielded construction

? Excellent DC/DC energy storage up to 5 MHz.

Filter inductor applications up to SRF (see

“Standard Electrical Specifications” table)

? Lowest DCR/μH, in this package size

? Handles high transient current spikes without saturation

? Ultra low buzz noise, due to composite construction

? Encapsulated body offers improved environmental

protection and moisture resistance

? Higher dielectric withstanding voltage vs. IHLP

? Flame retardant encapsulant (UL 94 V-0)

? Corrosion resistant package

? IHLP design. PATENT(S): www.vishay.com/patents

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

? PDA / notebook / desktop / server applications

? High current POL converters

? Low profile, high current power supplies

? Battery powered devices

? DC/DC converters in distributed power systems

? DC/DC converter for Field Programmable Gate Array

(FPGA)

? Harsh environments including moisture, chemicals and

salt spray