位置:ISD17210XYIR > ISD17210XYIR详情
ISD17210XYIR中文资料
ISD17210XYIR数据手册规格书PDF详情
GENERAL DESCRIPTION
The Winbond? ISD1700 ChipCorder? Series is a high quality, fully integrated, single-chip multi
message voice record and playback device ideally suited to a variety of electronic systems. The
message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the
specific device.
FEATURES
Integrated message management systems for single-chip, push-button applications
o REC:level-trigger for recording
o PLAY:edge-trigger for individual message or level-trigger for looping playback sequentially
o ERASE:edge-triggered erase for first or last message or level-triggered erase for all messages
o FWD:edge-trigger to advance to the next message or fast message scan during the playback
o VOL: 8 levels output volume control
o INT RDY : ready or busy status indication
o RESET: return to the default state
o Automatic power-down after each operation cycle
Message and operation indicators
o Four customizable Sound Effects (SEs) for audible indication
o Optional vAlert (voiceAlert) to indicate the presence of new messages
o LED: stay on during recording, blink during playback, forward and erase operations
Dual operating modes
o Standalone mode:
?Integrated message management techniques
Automatic power-down after each operation cycle
o SPI mode:
Fully user selectable and controllable options via APC register and various SPI commands
Two individual input channels
o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control)
o AnaIn: single-ended auxiliary analog input for recording or feed-through
Dual output channels
o Differential PWM Class D speaker outputs directly drives an 8 ?speaker or a typical buzzer
o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier
ChipCorder standard features
o High-quality, natural voice and audio reproduction
o 2.4V to 5.5V operating voltage
o 100-year message retention (typical)
o 100,000 record cycles (typical)
Temperature options:
o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)
o Industrial: -40°C to +85°C (packaged units)
Packaging types: available in die, PDIP, SOIC and TSOP
Package option: Lead-free packaged units
ISD17210XYIR产品属性
- 类型
描述
- 型号
ISD17210XYIR
- 制造商
WINBOND
- 制造商全称
Winbond
- 功能描述
Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYIR供应商...
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
深圳市华斯顿科技有限公司 |
ISD17240EY |
NUVOTON |
22+23+ |
TSOP |
19407 |
绝对原装正品全新进口深圳现货 |
|
瀚佳科技(深圳)有限公司 |
ISD17240EY |
NUVOTON |
24+ |
TSOP |
62300 |
原装现货/放心购买 |
|
深圳市科雨电子有限公司 |
ISD17240EY |
NUVOTON |
20+ |
TSOP-28 |
1001 |
就找我吧!--邀您体验愉快问购元件! |
|
深圳市河锋鑫科技有限公司 |
ISD17240EY |
Nuvoton Technology Corporation |
22+ |
28TSOP |
9000 |
原厂渠道,现货配单 |
|
深圳市芯福林电子科技有限公司 |
ISD17240EY |
Nuvoton Technology Corporation |
21+ |
28TSOP |
13880 |
公司只售原装,支持实单 |
|
贸泽芯城(深圳)电子科技有限公司 |
ISD17240EY |
NUVOTON/新唐 |
23+ |
TSOP |
4850 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|
易创佳业科技(深圳)有限公司 |
ISD17240EY |
Nuvoton Technology Corporation |
23+ |
28TSOP |
9000 |
原装正品,支持实单 |
|
深圳市安富世纪电子有限公司 |
ISD17240EY |
Nuvoton Technology Corporation |
23+ |
28-TSOP |
7300 |
专注配单,只做原装进口现货 |
|
深圳市能元时代电子有限公司 |
ISD17240P |
ISD |
23+ |
68679 |
##公司主营品牌长期供应100%原装现货可含税提供技术 |
||
上海意淼电子科技有限公司 |
ISD17240P/S |
MOT |
23+ |
NA |
6500 |
全新原装假一赔十 |
ISD17210XYIR 资料下载更多...
ISD17210XYIR 产品相关型号
- 30KPA280A
- 30KPA30CA
- 30KPA42CA
- 30KPA45CA
- 30KPA54A
- 30KPA70A
- ADC11C170
- ADC11C170CISQ
- ADC11C170LFEB
- BAV102
- BF909
- BF991
- BF992
- ISD17120EYIR
- ISD17150PY01
- ISD17150SYIR
- ISD17240EYIR
- ISD1750SYIR
- ISD1790PY01
- SM79108_06
- SM79108C40
- SM8951AC25
- SM8951AC40
- SM8954A
- SM8954AL25
- TDA8566
- TDA8566Q
- TDA8566TH
- TDA8595SD
- TDA9935HW
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
Winbond 华邦电子股份有限公司
华邦(Winbond)成立于1987年9月,1995年正式于台湾证券交易所挂牌上市。企业总部座落于台湾中部科学园区,在中科及南科各设有一座12吋高度智能化和自动化晶圆厂。 华邦电子为专业的内存集成电路公司,从产品设计、技术研发、晶圆制造到自有品牌营销全球,致力提供全球客户全方位利基型内存解决方案服务。核心产品包含编码型闪存(Code Storage Flash Memory)、TrustME? 安全闪存、利基型内存(Specialty DRAM)及行动内存(Mobile DRAM),是台湾唯一同时具备DRAM和Flash自有开发技术的厂商。华邦运用技术自主之优势及谨慎规划的产能策略,建立极具